As millions of data servers are installed worldwide each year, heat density of equipment in high-performance data centers continues to drive the need for more efficient and effective cooling technologies. In March, 2021, nVent and CoolIT announced a strategic alliance that offers customers complete and reliable high-density liquid cooled enclosure protection solutions.
Many high-performing computing (HPC) data centers are located within research institutions. These institutions use the advanced computing ability of HPC servers to deliver critical innovations—uncovering the mysteries of the universe and unlocking new possibilities in technology, energy and material sciences.
To generate the computing power necessary for cutting-edge research, an HPC research center in Berlin, Germany, uses advanced IT technology and chips that are packed very tightly together. This equipment is both expensive and fragile—it needs to be kept at optimal temperatures to operate efficiently and can break if it gets too hot. However, HPC systems and chips generate a large amount of heat during normal operations, complicating things for the research center’s data center managers.
The combination of nVent and CoolIT solutions was a great fit for the research center because the two companies could deliver advanced liquid cooling that directly cooled high-performance chips as well as technology that fit within the facility infrastructure.
Combining Air and Liquid Cooling
CoolIT's direct liquid cooling solution for the research center used a closed liquid circuit. Coolant is fed into the system using large supply lines in the lower area of the racks, and a coolant distribution unit (CDU) controls the rate of flow of the coolant through the system. This direct liquid cooling system cools chips in the racks that need to carry the highest computing load. Racks that contain equipment used for less demanding tasks like network administration do not have direct-to-chip cooling installed since they do not require the same intensive cooling.
All the racks in the research center are also equipped with nVent SCHROFF rack-mount rear door heat exchangers (RDHX). RDHX is an active air-to-liquid solution with fans that pull warm air out of the rack and through the heat exchanger. An integrated differential pressure sensor controls the airflow to match the cooling needs of the equipment, minimizing the energy consumption of the unit. A water control kit also regulates water flow according to the current heat load.
The RDHX is installed directly onto the equipment rack as a separate, complete rear door. This hybrid cooling system assembles two different cooling technologies (air and liquid cooling) in the same rack and captures the heat from the entire system. nVent's rear door design also includes a separate frame for the door, which will make it easy to retrofit the racks when the center needs to add additional computing power.
A Long-term Partnership
The entire project of designing and implementing the research center’s HPC data center took two years. nVent's expertise in the field of electronic infrastructure combined with CoolIT's state-of-the-art cooling technology helped keep the project on track and deliver a solution that worked for the customer.
“Such a project can only be rendered successfully if all parties involved bring the highest level of commitment and know-how to the table,” said Markus Gerber, sales manager for data center and network solutions in Europe. “In this instance, we had the pleasure of working closely with our colleagues at CoolIT. Seeing this complex project lay the foundation for top-quality research is fascinating, and it makes me proud.”
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